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XCVU19P-2FSVA3824E
IC FPGA 1976 I/O 3824FCBGA
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- Fr. Teil #XCVU19P-2FSVA3824E
- Paket BGA
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Spezifikationen
| Package | Tray |
| Series | Virtex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 510720 |
| NumberofLogicElements/Cells | 8937600 |
| TotalRAMBits | 79586918 |
| NumberofI/O | 1976 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 3824-BBGA, FCBGA |
Übersicht
Description
The architecture supports a range of functionalities, including integrated memory, high-bandwidth interfaces, and robust security features. With a maximum of 19 million logic cells, it provides significant parallel processing power, making it suitable for complex algorithms and real-time data processing tasks.
The device utilizes a 16nm FinFET technology, ensuring lower power consumption and high performance. It also supports various design tools and frameworks, facilitating the development of custom hardware solutions. Overall, the XCVU19P-2FSVA3824E is ideal for engineers looking to implement advanced digital solutions in demanding environments.
Features
1. Architecture: Built on a Versal Adaptive Compute Acceleration Platform (ACAP), integrating programmable logic with software programmability.
2. Processing Engines: Contains a combination of scalar, vector, and matrix processing engines to enhance performance for diverse workloads.
3. High Bandwidth Memory: Supports advanced memory interfaces including DDR4 and HBM (High Bandwidth Memory) for improved data throughput.
4. Connectivity: Offers a variety of connectivity options such as Ethernet, PCIe, and Serial interfaces, facilitating high-speed data transfer.
5. AI/ML Acceleration: Optimized for artificial intelligence and machine learning applications, providing hardware acceleration for inference tasks.
6. Scalability: Features a scalable architecture allowing for efficient deployment in various applications, from data centers to edge computing.
7. Development Tools: Compatible with Xilinx's Vitis and Vivado design environments for streamlined development and integration.
This FPGA is ideal for applications requiring flexibility, high performance, and adaptability, such as telecommunications, automotive, and data processing.
Package
Pinout
The primary functions of the XCVU19P FPGA include high-speed data processing, advanced signal processing, and complex system integration. It supports a variety of applications such as telecommunications, data centers, and aerospace and defense. The device incorporates numerous programmable logic resources, DSP slices, and memory blocks, along with high-speed transceivers for data communication.
In summary, the XCVU19P-2FSVA3824E has 3824 pins and is designed for high-performance applications requiring flexibility and extensive processing capabilities.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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