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XCVU9P-2FLGA2104I
IC FPGA 416 I/O 2104FCBGA
- Hersteller
- Fr. Teil #XCVU9P-2FLGA2104I
- Paket FBGA-2104
- Datenblatt
- Auf Lager6090
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Spezifikationen
| Package | Tray |
| Series | Virtex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 147780 |
| NumberofLogicElements/Cells | 2586150 |
| TotalRAMBits | 391168000 |
| NumberofI/O | 416 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 2104-BBGA, FCBGA |
Übersicht
Description
Key specifications include a maximum capacity of 9 million logic cells, multiple DSP slices for efficient signal processing, and support for a range of connectivity options such as PCIe and Ethernet. The FLGA2104 package indicates a fine-pitch ball grid array, which helps in achieving high-density designs.
The device offers flexibility through programmable architecture, allowing for customization in various applications, including AI inference, video processing, and networking. Additionally, the UltraScale+ architecture enhances performance and power efficiency, providing a balance of speed and functionality for demanding tasks. Overall, the XCVU9P-2FLGA2104I is a robust solution for engineers looking to implement cutting-edge hardware solutions.
Features
1. Logic Cells: It offers a substantial number of logic cells for complex applications.
2. DSP Slices: Equipped with numerous DSP slices for high-speed digital signal processing.
3. Memory: Supports large amounts of on-chip memory, enabling efficient data handling.
4. High-Speed I/O: Features multiple high-speed serial transceivers, facilitating fast data communication.
5. Power Efficiency: Designed for lower power consumption while maintaining performance.
6. Scalability: Suitable for various applications, from telecommunications to data centers and automotive systems.
7. Advanced Configuration: Supports various design methodologies including high-level synthesis and hardware/software co-design.
Overall, the XCVU9P-2FLGA2104I is ideal for applications requiring extensive processing power and flexibility, making it a popular choice in modern electronic designs.
Package
Pinout
The pins serve various functions, including:
1. I/O Pins: For general-purpose input/output operations, allowing interfacing with external devices.
2. Power Pins: Supply power to the FPGA core and I/O banks.
3. Clock Pins: Dedicated pins for clock signals to synchronize operations.
4. Configuration Pins: For programming and configuring the FPGA.
5. Ground Pins: To provide a stable reference voltage and reduce noise.
The XCVU9P model includes advanced features such as high-speed serial transceivers and programmable logic, making it suitable for demanding applications that require significant processing capabilities and high bandwidth.
Manufacturer
Application
Equivalent
Versand
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bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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