XCZU11EG-2FFVF1517I

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XCZU11EG-2FFVF1517I

IC SOC CORTEX-A53 1517FCBGA

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Spezifikationen

Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40x40)
Base Product Number XCZU11

Übersicht

Description

The XCZU11EG-2FFVF1517I is a member of the Xilinx Zynq UltraScale+ MPSoC family, combining a powerful ARM-based processing system with programmable logic (FPGA). It features a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a programmable logic section that allows for custom hardware acceleration. The "EG" designation indicates enhanced graphic capabilities.
This device includes 11,000 logic cells, multiple DSP slices, and a rich set of connectivity options, making it suitable for applications requiring high performance, such as automotive, industrial automation, and telecommunications. The package size is 1517 balls in a FFG (fine pitch ball grid array) configuration, facilitating integration into compact designs.
Additionally, it supports various interfaces like PCIe, USB, and Ethernet, enhancing its versatility in complex systems. The XCZU11EG-2FFVF1517I is ideal for developers looking to leverage both software and hardware for optimized processing solutions.

Features

The XCZU11EG-2FFVF1517I is a versatile, high-performance System on Chip (SoC) from Xilinx's Zynq UltraScale+ family. Key features include:
1. Processing Units: It combines a dual-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, allowing efficient handling of complex applications.
2. FPGA Fabric: The device includes a significant amount of programmable logic, enabling custom hardware acceleration for various tasks.
3. Memory: It supports a variety of memory interfaces, including DDR4 and LPDDR4, providing high bandwidth for data-intensive applications.
4. Connectivity: Integrated high-speed connectivity options such as PCIe, Ethernet, and USB, facilitating flexible system integration.
5. Power Efficiency: Designed for low power consumption while delivering high performance, making it suitable for embedded applications.
6. Security Features: Built-in security features help safeguard data and device integrity.
This SoC is ideal for applications in automotive, industrial, and communications sectors, providing a robust platform for developing advanced systems.

Package

The XCZU11EG-2FFVF1517I is packaged in a FFG (Fine-Pitch Flip-Chip) F1517 package type. This package features a 1517-ball arrangement and is designed for high-performance applications, providing effective thermal and electrical characteristics suitable for demanding environments.

Pinout

The XCZU11EG-2FFVF1517I is a part of the Xilinx Zynq UltraScale+ MPSoC family. It features a total of 1517 pins. The device combines a processing system (PS) with programmable logic (PL) and is designed to handle a variety of applications ranging from embedded systems to high-performance computing.
Key functions of the pins include:
- Power Supply Pins (VCC, GND): For providing power to the chip.
- I/O Pins: Configurable for general-purpose input/output (GPIO), interfaces like I2C, SPI, UART, etc.
- High-Speed Serial Interfaces: Such as PCIe, Gigabit Ethernet, and USB.
- Clock Pins: For providing clock signals.
- Configuration Pins: Used for loading the device configuration during startup.
The combination of these functions allows the XCZU11EG to support various applications in fields like industrial automation, automotive, and telecommunications.

Manufacturer

The XCZU11EG-2FFVF1517I is manufactured by Xilinx, Inc., which is a leading company in the field of programmable logic devices. Xilinx specializes in Field Programmable Gate Arrays (FPGAs), System on Chips (SoCs), and adaptive computing solutions. Founded in 1984, Xilinx pioneered the FPGA technology and has since become a key player in providing innovative solutions for various applications, including telecommunications, automotive, industrial, and data centers. In October 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its capabilities in the semiconductor industry. The XCZU11EG-2FFVF1517I is part of the Zynq UltraScale+ MPSoC family, which combines programmable logic with ARM-based processing cores, enabling high performance and flexibility for complex applications.

Application

The XCZU11EG-2FFVF1517I, part of Xilinx's Zynq UltraScale+ MPSoC family, is designed for applications in aerospace, automotive, industrial automation, telecommunications, and data centers. It supports high-performance computing tasks, real-time processing, and complex algorithm implementations, making it suitable for edge computing, video processing, and machine learning applications. Its versatility allows integration of both software and hardware, facilitating rapid prototyping and deployment in embedded systems.

Equivalent

The XCZU11EG-2FFVF1517I is a part of the Xilinx Zynq UltraScale+ MPSoC family. Equivalent products include the XCZU11EG-2FFVE1517I, which is similar but may have different package options or specifications. Other alternatives could be XCZU7EG and XCZU19EG, depending on specific application requirements like performance, I/O capabilities, and power consumption. Always check the datasheets for detailed comparisons.

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EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

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