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XCZU11EG-2FFVF1517I
IC SOC CORTEX-A53 1517FCBGA
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Spezifikationen
| Series | Zynq® UltraScale+™ MPSoC EG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1517-BBGA, FCBGA |
| Supplier Device Package | 1517-FCBGA (40x40) |
| Base Product Number | XCZU11 |
Übersicht
Description
This device includes 11,000 logic cells, multiple DSP slices, and a rich set of connectivity options, making it suitable for applications requiring high performance, such as automotive, industrial automation, and telecommunications. The package size is 1517 balls in a FFG (fine pitch ball grid array) configuration, facilitating integration into compact designs.
Additionally, it supports various interfaces like PCIe, USB, and Ethernet, enhancing its versatility in complex systems. The XCZU11EG-2FFVF1517I is ideal for developers looking to leverage both software and hardware for optimized processing solutions.
Features
1. Processing Units: It combines a dual-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, allowing efficient handling of complex applications.
2. FPGA Fabric: The device includes a significant amount of programmable logic, enabling custom hardware acceleration for various tasks.
3. Memory: It supports a variety of memory interfaces, including DDR4 and LPDDR4, providing high bandwidth for data-intensive applications.
4. Connectivity: Integrated high-speed connectivity options such as PCIe, Ethernet, and USB, facilitating flexible system integration.
5. Power Efficiency: Designed for low power consumption while delivering high performance, making it suitable for embedded applications.
6. Security Features: Built-in security features help safeguard data and device integrity.
This SoC is ideal for applications in automotive, industrial, and communications sectors, providing a robust platform for developing advanced systems.
Package
Pinout
Key functions of the pins include:
- Power Supply Pins (VCC, GND): For providing power to the chip.
- I/O Pins: Configurable for general-purpose input/output (GPIO), interfaces like I2C, SPI, UART, etc.
- High-Speed Serial Interfaces: Such as PCIe, Gigabit Ethernet, and USB.
- Clock Pins: For providing clock signals.
- Configuration Pins: Used for loading the device configuration during startup.
The combination of these functions allows the XCZU11EG to support various applications in fields like industrial automation, automotive, and telecommunications.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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