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XCZU17EG-2FFVC1760I
IC SOC CORTEX-A53 1760FCBGA
- Hersteller
- Fr. Teil #XCZU17EG-2FFVC1760I
- Paket FBGA-1760
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Spezifikationen
| Package | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1760-BBGA, FCBGA |
Übersicht
Description
This particular model features 17,000 logic cells and offers a rich set of I/O options, including high-speed transceivers and support for various interfaces such as PCIe, Ethernet, and USB. It is designed for applications requiring intensive data processing, real-time performance, and customizable hardware, making it suitable for use in industries like telecommunications, automotive, and industrial automation.
The XCZU17EG-2FFVC1760I operates at a nominal voltage of 1.0V and comes in a compact FFG1760 package, making it suitable for space-constrained environments. With its advanced capabilities, this SoC is ideal for developing sophisticated embedded systems that leverage both software and hardware efficiencies.
Features
1. Architecture: Combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processing unit, enabling efficient processing for varied tasks.
2. FPGA Fabric: Offers a significant amount of programmable Logic resources, including 17,580 LUTs and 3,828 Kbits of block RAM, allowing custom hardware implementations.
3. DSP: Equipped with high-performance DSP slices, facilitating complex signal processing tasks.
4. I/O Capabilities: Supports various I/O standards and protocols, including high-speed transceivers (up to 16.3 Gbps), making it suitable for communication interfaces.
5. Memory Interfaces: Provides support for DDR4/DDR3 memory interfaces, enhancing the system's memory bandwidth.
6. Power Efficiency: Designed for low power consumption, making it suitable for embedded and portable applications.
The XCZU17EG-2FFVC1760I is ideal for applications like automotive, industrial automation, and telecommunications due to its balance of processing power and flexibility.
Package
Pinout
The pin functions include power supply pins, ground pins, I/O pins, configuration pins, and various specialized interfaces for high-speed communication like PCIe, USB, and Ethernet. Additionally, it provides support for multiple protocols such as I2C, SPI, and UART. The device is designed for applications in industrial, automotive, and telecommunications sectors, offering flexibility in design and integration for complex systems.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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