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XCZU19EG-2FFVC1760I
IC SOC CORTEX-A53 1760FCBGA
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- Fr. Teil #XCZU19EG-2FFVC1760I
- Paket FBGA-1760
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Spezifikationen
| Package | Tray |
| Series | Zynq® UltraScale+™ MPSoC EG |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 600MHz, 1.3GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1760-BBGA, FCBGA |
Übersicht
Description
This SoC integrates FPGA fabric, providing customizable hardware logic, which allows for parallel processing and optimized performance for specific applications. The XCZU19EG offers significant resources, including up to 19K logic cells, multiple DSP slices for signal processing, and extensive I/O capabilities.
Additionally, it supports various connectivity options, such as PCIe, Ethernet, and serial transceivers, making it suitable for data-intensive applications. The device operates within a wide temperature range, ensuring reliability in different environmental conditions. Overall, the XCZU19EG-2FFVC1760I is ideal for applications requiring high computational power, flexibility, and real-time processing capabilities.
Features
1. Architecture: Combines a powerful ARM Cortex-A53 quad-core processor with an ARM Cortex-R5 dual-core real-time processor for versatile computing capabilities.
2. FPGA Fabric: Integrates a large number of programmable logic resources, including 19,200 LUTs and 39,000 flip-flops, enabling custom hardware acceleration.
3. DSP Slices: Features 1,240 DSP slices for efficient signal processing tasks.
4. Memory Interfaces: Supports various memory interfaces, including DDR4, with up to 2,133 MT/s data rates.
5. Connectivity: Offers multiple high-speed I/O options, including PCIe, USB, and Ethernet, facilitating extensive connectivity.
6. Power Efficiency: Designed for low power consumption with dynamic voltage and frequency scaling.
7. Development Support: Compatible with Xilinx's Vivado Design Suite and SDK for streamlined development.
This device targets applications in automotive, industrial, and telecommunications sectors, providing flexibility and high performance.
Package
Pinout
The device integrates a multiprocessor system-on-chip architecture that includes a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and programmable logic (FPGA). The pins serve various functions, including I/O, power, ground, and dedicated interfaces for communication protocols such as PCIe, USB, Ethernet, and more. The flexibility of the FPGA fabric allows for custom logic design, while the ARM cores handle processing tasks.
This combination makes the XCZU19EG-2FFVC1760I suitable for applications in areas such as automotive, industrial, and communications, where high performance and versatility are required.
Manufacturer
Application
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Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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