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XCZU47DR-2FFVE1156I
IC ZUP RFSOC A53 FPGA 1156BGA
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- Fr. Teil #XCZU47DR-2FFVE1156I
- Paket BBGA-1156
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Spezifikationen
| Package | Tray |
| Series | Zynq® UltraScale+™ RFSoC |
| ProductStatus | Active |
| Architecture | MCU, FPGA |
| CoreProcessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAMSize | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 533MHz, 1.333GHz |
| PrimaryAttributes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1156-BBGA, FCBGA |
Übersicht
Description
Key attributes include:
- Architecture: The device integrates both hardware and software programmability, allowing for efficient data processing and control.
- Memory Interfaces: Supports various memory interfaces, including DDR4, for high-speed data access.
- Connectivity: Offers multiple high-speed I/O options, suitable for diverse applications, including communications, automotive, and industrial control.
- Power Efficiency: Designed for low power consumption, making it ideal for embedded systems.
The XCZU47DR-2FFVE1156I is typically used in applications requiring intense processing, such as machine learning, video processing, and real-time data analytics. Its flexibility and performance make it a popular choice for engineers seeking to develop advanced embedded solutions.
Features
- Processing Power: Integrated ARM Cortex-A53 and Cortex-R5 cores for high-performance processing and real-time capabilities.
- FPGA Fabric: Significant configurable logic resources, allowing for custom hardware acceleration.
- Memory Interface: Supports DDR4, LPDDR4, and other memory types for high-bandwidth memory access.
- Connectivity: Multiple high-speed interfaces, including PCIe, USB, Ethernet, and CAN for versatile connectivity options.
- Digital Signal Processing (DSP): DSP slices for high-performance signal processing tasks.
- Security Features: Built-in security mechanisms for data protection and secure boot.
- Thermal Management: Designed for efficient thermal performance to support various applications.
This SoC is ideal for applications in automotive, industrial, and communications sectors, enabling complex processing and efficient control in embedded systems.
Package
Pinout
The pin functions include power supply pins, ground pins, I/O pins for interfacing with peripherals, configuration pins for device programming, and dedicated pins for high-speed serial transceivers. The I/O pins can be configured for various standards, such as LVDS, LVCMOS, and others, allowing flexible connectivity options.
The architecture supports a wide range of applications in embedded systems, including data processing, control systems, and real-time computing. Overall, it offers a versatile platform for developing complex digital designs with both hardware and software components.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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