XCZU47DR-2FFVG1517I

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XCZU47DR-2FFVG1517I

IC ZUP RFSOC A53 FPGA 1517BGA

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  • Fr. Teil #XCZU47DR-2FFVG1517I
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Spezifikationen

Package Tray
Series Zynq® UltraScale+™ RFSoC
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAMSize 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.333GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 1517-BBGA, FCBGA

Übersicht

Description

The XCZU47DR-2FFVG1517I is a member of Xilinx's Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family, which integrates a powerful ARM-based processing system with a high-performance programmable logic (FPGA) fabric. This specific model features a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and a Graphics Processing Unit (GPU), enabling efficient handling of complex applications.
The "DR" designation indicates a device with a specific set of features tailored for high-performance and low-power applications. The FPGA fabric allows for custom hardware acceleration and flexibility in design, making it suitable for applications such as telecommunications, automotive, industrial automation, and medical devices.
The XCZU47DR-2FFVG1517I is packaged in a 1517-pin FFG (Fine Pitch Grid Array) format, facilitating easy integration into various systems. It supports advanced connectivity and interfacing options, including high-speed transceivers. Overall, the XCZU47DR-2FFVG1517I is ideal for developers seeking a balance of processing power and flexibility in their designs.

Features

The XCZU47DR-2FFVG1517I is a versatile device from Xilinx's Zynq UltraScale+ MPSoC family. Key features include:
1. Architecture: Combines a dual-core ARM Cortex-A53 application processor with a dual-core ARM Cortex-R5 real-time processor.
2. FPGA Fabric: Offers a significant amount of programmable logic with around 23,300 logic cells, enabling custom hardware acceleration.
3. DSP Resources: Includes 220 DSP slices for high-performance digital signal processing tasks.
4. Memory Interface: Supports multiple memory interfaces, including DDR4 and LPDDR4, facilitating high-bandwidth memory access.
5. I/O Capabilities: Features a wide range of I/O options including PCIe, USB, and UART interfaces.
6. Power Management: Designed for low-power operation, suitable for embedded and edge applications.
7. Security Features: Provides robust security options, including secure boot and encryption.
This combination of processing power, flexibility, and connectivity makes the XCZU47DR suitable for applications in telecommunications, automotive, industrial automation, and more.

Package

The XCZU47DR-2FFVG1517I is packaged in a 1517-pin FFG (Fine Pitch Ball Grid Array) package, which provides a compact footprint and facilitates high-density interconnections for advanced applications in the Zynq UltraScale+ family by Xilinx.

Pinout

The XCZU47DR-2FFVG1517I is part of the Xilinx Zynq UltraScale+ MPSoC family. It features a pin count of 1517 pins.
The device combines a quad-core ARM Cortex-A53 processor with dual ARM Cortex-R5 real-time processors and programmable logic (FPGA). Its functions include high-performance processing, embedded system integration, and extensive connectivity options. The MPSoC architecture allows for concurrent processing of software and hardware tasks, making it suitable for applications in automotive, industrial, and communications sectors.
Key features include multiple I/O interfaces, high-speed transceivers, and integrated memory controllers, enabling flexible design configurations for various application requirements.

Manufacturer

The XCZU47DR-2FFVG1517I is manufactured by Xilinx, Inc., which is a subsidiary of Advanced Micro Devices (AMD). Xilinx is a semiconductor company known for its development of programmable devices, specifically Field Programmable Gate Arrays (FPGAs), System on Chips (SoCs), and Adaptive Compute Acceleration Platforms (ACAPs). Founded in 1984, Xilinx pioneered the FPGA technology and has been a key player in the digital circuit design space, providing solutions across various industries such as telecommunications, automotive, aerospace, and consumer electronics. With a focus on innovation, Xilinx enables designers to create customizable and flexible hardware solutions tailored to specific application needs.

Application

The XCZU47DR-2FFVG1517I, part of Xilinx's Zynq UltraScale+ MPSoC family, is suitable for various application areas, including automotive, industrial automation, aerospace, and defense. It excels in real-time processing, machine learning, embedded vision, and digital signal processing. Common use cases include advanced driver assistance systems (ADAS), robotics, high-performance computing, and IoT applications, where flexibility and high performance are critical.

Equivalent

The XCZU47DR-2FFVG1517I is a variant of the Xilinx Zynq UltraScale+ MPSoC series. Equivalent products include XCZU47DR-2FFVG1517E, XCZU47DR-2FFVG1517C, and other members of the Zynq UltraScale+ family, depending on specific requirements like package type, speed grade, and functionality. Additionally, similar performance can be found in competing products like Intel's Stratix 10 or Altera FPGAs, but exact equivalence would depend on application needs.

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UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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