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XCZU4CG-1FBVB900E
IC SOC CORTEX-A53 900FCBGA
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Spezifikationen
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Architecture | MCU, FPGA |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| RAM Size | 256KB |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed | 500MHz, 1.2GHz |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 900-BBGA, FCBGA |
| Supplier Device Package | 900-FCBGA (31x31) |
| Base Product Number | XCZU4 |
Übersicht
Description
The XCZU4CG-1FBVB900E is optimized for low power consumption while delivering high performance for compute-intensive tasks. Its programmable logic allows users to customize hardware acceleration for specific applications, enhancing overall efficiency. The device is housed in a compact BGA package, making it ideal for space-constrained environments. With extensive development tools and a robust ecosystem, including the Vitis and Vivado Design Suites, developers can quickly design and deploy applications tailored to their needs.
Features
1. Processing System: Quad-core ARM Cortex-A53 (up to 1 GHz) for high-performance applications, and dual-core Cortex-R5 for real-time tasks.
2. FPGA Fabric: Offers programmable logic with around 4,680 LUTs, enabling custom hardware acceleration.
3. Memory Interface: Supports DDR4/DDR3 memory interfaces, enhancing data throughput.
4. Connectivity: Includes high-speed transceivers (up to 6.6 Gbps), enabling various communication protocols.
5. I/O Capabilities: Multiple GPIO and peripheral interfaces for extensive connectivity.
6. Power Efficiency: Designed for low power consumption while maintaining high performance.
7. Integrated Features: Contains hardware security features and support for industrial applications.
This combination of processing power and programmable logic makes it suitable for applications in automotive, industrial, and communication systems.
Package
Pinout
The pin functions include:
1. Power Supply Pins: For powering the device (VCC and ground).
2. Configuration Pins: For loading the FPGA configuration.
3. I/O Pins: General-purpose I/O for interfacing with external devices.
4. High-Speed Transceivers: For high-speed data communication.
5. Clock and Reset Pins: For timing and initialization.
This versatile architecture supports various applications including embedded systems, automotive, and digital signal processing.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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