XCZU7EV-1FBVB900E

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XCZU7EV-1FBVB900E

IC SOC CORTEX-A53 900FCBGA

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Spezifikationen

Series Zynq® UltraScale+™ MPSoC EV
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31)
Base Product Number XCZU7

Übersicht

Description

The XCZU7EV-1FBVB900E is a member of Xilinx's Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family, combining a powerful ARM-based processing system with programmable logic. This device features a dual-core ARM Cortex-A53 application processor, a dual-core ARM Cortex-R5 real-time processor, and extensive FPGA fabric for custom hardware acceleration.
With a total of 6,840 logic cells and integrated DSP slices, the XCZU7EV supports high-performance applications in diverse fields such as automotive, aerospace, telecommunications, and industrial automation. It offers rich I/O options, including high-speed transceivers and various protocols, allowing seamless integration into complex systems.
Key features include:
- 1.3 GHz ARM Cortex-A53 and Cortex-R5 processors
- 216 programmable logic cells
- Up to 6.6 Gbps transceivers
- Extensive memory interfaces including DDR4
Designed for high efficiency and flexibility, the XCZU7EV is ideal for applications requiring real-time processing and hardware programmability, enabling developers to tailor solutions to specific needs.

Features

The XCZU7EV-1FBVB900E is a member of the Xilinx Zynq UltraScale+ MPSoC family, featuring a heterogeneous architecture that combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor. Key features include:
- FPGA Fabric: It integrates a significant amount of programmable logic with 7,200 logic cells and multiple DSP slices.
- Memory: Supports DDR4 memory interfaces, allowing for high-speed data processing.
- Connectivity: Offers a range of high-speed I/O options, including PCIe, USB, and Ethernet interfaces.
- Performance: Capable of operating at high clock frequencies (up to 1.2 GHz for the ARM cores) and optimized for low power consumption.
- Security: Enhanced security features including hardware root of trust and secure boot capabilities.
This device is ideal for applications in embedded vision, industrial automation, and telecommunications, balancing processing power with programmable logic flexibility.

Package

The XCZU7EV-1FBVB900E is packaged in a FFG (Fine Pitch Flip Chip) BGA (Ball Grid Array) format, specifically a 900-ball configuration. This package type is designed for high-performance applications, providing efficient thermal management and space-saving benefits.

Pinout

The XCZU7EV-1FBVB900E is a member of the Xilinx Zynq UltraScale+ MPSoC family. It has a pin count of 900.
The device combines a high-performance processing system (PS) with programmable logic (PL). The functionality includes advanced features such as multiple I/O interfaces, high-speed transceivers, and various configurations suitable for applications in telecommunications, automotive, industrial, and more.
Key features include:
- ARM Cortex-A53 and Cortex-R5 processors for general-purpose computing
- Programmable logic for custom hardware acceleration
- Multiple high-speed serial transceivers (up to 28 Gbps)
- Numerous I/O standards support (e.g., LVDS, PCIe, Ethernet)
- Integrated memory interfaces (DDR4, LPDDR4)
This combination allows for diverse applications requiring both software and hardware programmable elements, providing flexibility and performance.

Manufacturer

The XCZU7EV-1FBVB900E is manufactured by Xilinx, Inc., which is a semiconductor company specializing in programmable logic devices. Xilinx is known for its field-programmable gate arrays (FPGAs), system-on-a-chip (SoC) solutions, and other adaptive computing technologies. The company, founded in 1984, has played a significant role in the development of reconfigurable hardware for a variety of applications, including telecommunications, automotive, aerospace, and industrial markets. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further enhancing its capabilities in adaptive computing and high-performance processing.

Application

The XCZU7EV-1FBVB900E, part of Xilinx's Zynq UltraScale+ family, is ideal for applications in automotive, industrial automation, medical imaging, and high-performance computing. Its capabilities support real-time data processing, machine learning, and video processing, making it suitable for tasks such as autonomous driving, robotics, and advanced signal processing. Additionally, its flexibility allows for integration in communication systems and IoT devices.

Equivalent

The XCZU7EV-1FBVB900E is part of Xilinx's Zynq UltraScale+ family. Equivalent products include the XCZU7EV-2FFVC1156E and XCZU7EV-3FFVC1156E, which differ primarily in performance and power specifications. Additionally, other models from the Zynq UltraScale+ series, like the XCZU6EV and XCZU9EV, may offer similar functionalities but with varying resource specifications. Always check the specific requirements for compatibility.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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