XCZU9CG-2FFVC900I

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XCZU9CG-2FFVC900I

IC SOC CORTEX-A53 900FCBGA

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Spezifikationen

Package Tray
Series Zynq® UltraScale+™ MPSoC CG
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
RAMSize 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.3GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 900-BBGA, FCBGA

Übersicht

Description

The XCZU9CG-2FFVC900I is a member of Xilinx's Zynq UltraScale+ MPSoC family, combining a powerful ARM Cortex-A53 application processor with a real-time ARM Cortex-R5 processor and Xilinx's high-performance programmable logic (FPGA). This specific model features a 900K logic cell capacity, making it suitable for complex applications in data processing, communications, and machine learning.
The device supports various interfaces, including PCIe, USB, and Ethernet, allowing flexible connectivity options. It operates at a wide range of temperatures, making it suitable for industrial and automotive applications. The XCZU9CG also benefits from advanced security features and design tools like Vivado and Vitis, facilitating efficient development and deployment of embedded systems.
Overall, the XCZU9CG-2FFVC900I is designed for high-performance applications requiring both processing power and hardware programmability, making it ideal for areas such as AI, video processing, and telecommunications.

Features

The XCZU9CG-2FFVC900I is part of Xilinx's Zynq UltraScale+ MPSoC family, combining a powerful ARM Cortex-A53 quad-core processor with an ARM Cortex-R5 real-time processor and programmable logic. Key features include:
1. Processing Performance: Four ARM Cortex-A53 cores for high-performance applications and dual ARM Cortex-R5 cores for real-time processing.
2. FPGA Logic: Over 1.5 million logic cells for custom hardware acceleration.
3. Memory Interfaces: Supports DDR4 and LPDDR4 memory interfaces for high bandwidth.
4. I/O Capabilities: Numerous I/O options including high-speed transceivers, GPIOs, and support for various communication protocols like PCIe, UART, and Ethernet.
5. Power Efficiency: Designed for low power consumption while delivering high performance.
6. Integrated Peripherals: Includes various integrated peripherals like USB, CAN, and I2C for versatile connectivity options.
7. Security Features: Built-in hardware security to protect designs and data.
This combination enables a wide range of applications such as automotive, industrial automation, and communications systems.

Package

The XCZU9CG-2FFVC900I is packaged in a 900-ball FFG (Flip Chip Ball Grid Array) form factor. This type of package allows for high-density interconnections and efficient thermal management, making it suitable for demanding applications in telecommunications, data centers, and industrial automation.

Pinout

The XCZU9CG-2FFVC900I is a part of the Xilinx Zynq UltraScale+ MPSoC family. It features a pin count of 900.
Functionally, this device combines a dual-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and programmable logic (FPGA) resources. It includes advanced features such as high-speed transceivers, various I/O options, and integrated memory controllers. The Zynq UltraScale+ architecture is designed for applications requiring high performance, scalability, and flexibility, including communications, automotive, industrial, and aerospace systems.
Overall, the XCZU9CG-2FFVC900I offers a versatile platform for implementing complex processing tasks alongside programmable hardware.

Manufacturer

The XCZU9CG-2FFVC900I is manufactured by Xilinx, which is a subsidiary of Advanced Micro Devices (AMD). Xilinx specializes in programmable logic devices, including field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and other related technologies. The company is known for its innovations in technology that enable designers to create complex electronic systems efficiently. Xilinx products are widely used in various industries, including telecommunications, automotive, aerospace, industrial automation, and data centers, providing flexible solutions for custom hardware acceleration and processing.

Application

The XCZU9CG-2FFVC900I, part of Xilinx's Zynq UltraScale+ MPSoC family, is ideal for applications in automotive, aerospace, industrial automation, and telecommunications. Its high-performance processing capabilities and integrated programmable logic make it suitable for real-time data processing, video and image processing, machine learning, and edge computing. Common use cases include advanced driver assistance systems (ADAS), robotics, IoT gateways, and high-speed communication systems.

Equivalent

The XCZU9CG-2FFVC900I is part of Xilinx's Zynq UltraScale+ family. Equivalent products include the XCZU9EG, XCZU7EV, and XCZU7CG, which offer similar processing capabilities, but variations in graphics, I/O, and power consumption. For specific applications, refer to the datasheets to ensure compatibility and performance alignment.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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