XCZU9EG-1FFVB1156I

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XCZU9EG-1FFVB1156I

IC SOC CORTEX-A53 1156FCBGA

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Spezifikationen

Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Architecture MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAM Size 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 500MHz, 600MHz, 1.2GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1156-BBGA, FCBGA
Supplier Device Package 1156-FCBGA (35x35)
Base Product Number XCZU9

Übersicht

Description

The XCZU9EG-1FFVB1156I is a member of Xilinx's Zynq UltraScale+ MPSoC family, designed for high-performance applications requiring advanced processing capabilities. This device integrates a powerful ARM Cortex-A53 quad-core processor and a dual-core ARM Cortex-R5 real-time processor, alongside a programmable logic fabric featuring FPGA capabilities. It operates at a maximum clock frequency of 1.5 GHz.
With 9,000 logic cells and a rich set of I/O options, the XCZU9EG is ideal for applications in telecommunications, automotive, industrial automation, and machine learning. It supports various communication protocols and has extensive on-chip memory and high bandwidth memory interfaces.
The "1FFVB1156I" designation indicates its specific package and temperature range, where "FFVB" denotes a fine-pitch ball grid array (FBGA) package, and "I" signifies an industrial-grade temperature range. This device is suitable for applications needing robust performance, flexibility, and reliability in challenging environments.

Features

The XCZU9EG-1FFVB1156I is a member of the Xilinx Zynq UltraScale+ MPSoC family, designed for high-performance applications. Key features include:
1. Architecture: Combines a quad-core ARM Cortex-A53 processor with dual-core ARM Cortex-R5 real-time processors for robust processing capabilities.
2. FPGA Fabric: Integrates programmable logic with up to 504K logic cells, enabling customized hardware acceleration.
3. Memory Support: Features support for DDR4/3/2, providing high bandwidth for memory-intensive applications.
4. High-Speed I/O: Includes multiple high-speed transceivers (up to 28 Gbps) and various interface options like PCIe, USB, and Ethernet.
5. DSP Slices: Contains DSP slices for efficient processing of complex algorithms, ideal for applications in signal processing.
6. Power Management: Offers advanced power management features for energy-efficient operation.
7. Security Features: Includes built-in security mechanisms to protect designs and data integrity.
These attributes make the XCZU9EG-1FFVB1156I suitable for applications in telecommunications, automotive, industrial automation, and more.

Package

The XCZU9EG-1FFVB1156I is packaged in a FFG (Fine Pitch Ball Grid Array) package type, specifically a 1156-ball configuration. This design allows for efficient thermal management and high-density interconnections suitable for advanced applications.

Pinout

The XCZU9EG-1FFVB1156I is part of Xilinx's Zynq UltraScale+ MPSoC family. It features a pin count of 1156 pins.
This device integrates a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 processor, programmable logic (FPGA), and various peripherals. The I/O pins support multiple functions, including general-purpose I/O (GPIO), high-speed interfaces (e.g., PCIe, USB, SDIO), and various communication protocols (e.g., I²C, SPI, UART).
Additionally, the device provides dedicated pins for power, ground, and configuration, supporting versatile applications in areas like automotive, industrial, and telecommunications. The device is available in a fine-pitch ball grid array (FBGA) package, ensuring a compact design suitable for dense layouts.

Manufacturer

The XCZU9EG-1FFVB1156I is manufactured by Xilinx, Inc., which is a technology company specializing in programmable logic devices, including field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and other integrated circuits. Founded in 1984 and headquartered in San Jose, California, Xilinx is known for its innovative solutions in the fields of data center, automotive, aerospace, and industrial applications. The company focuses on providing high-performance, adaptive computing technologies that enable engineers to design and implement complex digital systems more efficiently. In October 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding AMD's capabilities in the semiconductor market.

Application

The XCZU9EG-1FFVB1156I is a versatile FPGA from Xilinx's Zynq UltraScale+ series, suitable for applications in advanced computing, data processing, and connectivity. Key areas include telecommunications, automotive systems, industrial automation, robotics, machine learning, and high-performance computing. Its integration of programmable logic and ARM processors facilitates edge computing, AI inference, and real-time data analysis in diverse embedded systems.

Equivalent

The XCZU9EG-1FFVB1156I is a Xilinx Zynq UltraScale+ MPSoC. Equivalent products include:
1. Intel (Altera) Cyclone 10 GX - for similar FPGA capabilities.
2. Lattice ECP5 - for lower power applications.
3. Microsemi (now part of Microchip) SmartFusion2 - for integrated ARM and FPGA solutions.
4. Xilinx Zynq 7000 series - for lower performance requirements.
However, exact equivalents may vary based on specific application needs, so it's advisable to consider performance specifications, resources, and features.

Versand

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von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

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