22-DIP (0.400, 10.16mm)
| Fr. Teil# | Beschreibung | Hersteller | Auf Lager | Operation |
| CD22212E1 | SINGLE-CHIP 1200BPS MODEM | 7312 |
|
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| HC5515CP | ITU LOW COST, PABX SLIC | 6044 |
|
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| HC5526CP | ITU CO/PABX SLIC | 9323 |
|
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| HC5515IP | ITU LOW COST, PABX SLIC | 8649 |
|
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| HC5526IP | ITU LOW COST, PABX SLIC | 9890 |
|
|
| HC5523IP | LSSGR/TR57 CO/LOOP CARRIER SLIC | 9234 |
|
|
| HC5503TCP | BALANCED PBX/KEY SYSTEM SLIC | 8076 |
|
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| HC5513BIM | IC TELECOM INTERFACE 22DIP | 925 |
|
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| HC5503CCP | UNBALANCED PBX/KEY SYSTEM SLIC | 3323 |
|
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| M-985-01P | IC TELECOM INTERFACE 22DIP | 9211 |
|
|
| MWS5101AEL3 | 256X4-BIT STANDARD SRAM | 6535 |
|
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| HM3-6551B-9 | 256 X 4 CMOS RAM | 578 |
|
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| HM3-6551-5 | 256 X 4 CMOS RAM | 8556 |
|
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| MWS5101EL2X | 256X4-BIT STANDARD SRAM | 4681 |
|
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| MWS5101AEL2 | 256X4-BIT STANDARD SRAM | 8005 |
|
|
| CDP1872CE | 8-BIT INPUT AND OUTPUT PORT | 2884 |
|
Andere Pakete
- TO-226-3, TO-92-3 Short Body (Formed Leads)
- 184-BCQFP
- 40-DIP (0.620, 15.75mm)
- INT-A-Pak
- 54-LFBGA
- 165-TBGA
- TFBGA-78
- 16-VFLGA
- 20-Lead LQFN (4mm x 3mm x 0.94mm w/ EP)
- 18-DIP Module (0.850, 21.59mm), 9 Leads
- DO-201AA, DO-27, Axial
- PG-TSDSO-24
- 0805 (2012 Metric), 8 PC Pad
- 780-FBGA
- 32-CDIP (0.900, 22.86mm)